Electronics Forum | Mon Nov 20 13:35:52 EST 2006 | cuculi54986@yahoo.com
We evaluated the OM338 from Alpha and it worked great! Looked like crap, though, compared to the other products out there. When I set the boards out in front of the Alpha sales guy to show him the difference in appearance between his boards and the
Electronics Forum | Fri Apr 07 17:44:07 EDT 2006 | ratsalad
I still have half of a 500 g jar of this paste left. I'm going to give it another shot, but my first experience was not so wonderful. Everything was great until we reflowed it. Our profile matched AIM's recommendation, as far as I can see. The ch
Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf
I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p
Electronics Forum | Thu May 13 17:31:48 EDT 2021 | bandjwet
We have a PCB rework dilemma involving a reflow profile. This is a SAC305/Low Solids (aka no clean) process where we are currently hand soldering (5) components that were DNP. The boards have an acrylic coating and we take off the acrylic at the par
Electronics Forum | Fri Feb 17 13:10:34 EST 2006 | amol_kane
I have Immersion Ag and Immersion Sn LF boards that were waved using SAC305 alloy. I have a lot of tears/shrink voids in the waved connections. I am aware that SAC305 in wave has a propensity of shrink tears/voids due to the non eutectic property of
Electronics Forum | Fri Nov 03 11:06:13 EST 2006 | rgduval
The process that burnt the tips up yesterday was hand soldering/touch up of lead-free assemblies. Not even assembly, but just touching up boards that we've soldered on a solder pot...which will lead to another question. We're using SAC 305 WS482 3
Electronics Forum | Wed Feb 04 10:24:05 EST 2009 | dyoungquist
We use SN100C in our selective solder process. The 3 keys to proper hole fill are applying a proper amount of flux, heating of the pcb and solder temperature. If either the pcb or solder is not hot enough, you may not get good hole fill. To adjus
Electronics Forum | Thu May 13 20:40:25 EDT 2021 | winston_one
Yes, we can't use pure Pb PROCESS. And as I say we will not use it anyway, as we have lead-free BGA's, LGAs, component with Solder Charged Terminations... It's became almost normal practice to solder it with leaded solder pastes. In this case peak re
Electronics Forum | Mon Dec 28 08:51:45 EST 2009 | jax
What solder are you talking about and what reflow method are you using? High Melt Alloys: SN96 (Sn96/Ag4 or Sn96.5/Ag3.5) - Simliar to SAC305 although normally uses Rosin based flux that can required more extensive cleaning. Pb85 (Pb85/Sb10/Sn5) -
Electronics Forum | Mon Jun 09 14:09:06 EDT 2014 | jorge_quijano
Hola... I'm in the middle of a project to reduce assembly time in one of our products, this product has a lot of TH connectors to be soldered by hand, I'm implementing PHIR, first run has been completed, the appearance of the solder joints are obvio
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